Alaa B. El-Rouby

According to our database, Alaa B. El-Rouby authored at least 11 papers between 2011 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays.

Karim Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea I. Ismail

Microelectron. J., 2015

Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays.

Kareem Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea Ismail

Proceedings of the 5th International Conference on Energy Aware Computing Systems & Applications, 2015

2013

TSV-based on-chip inductive coupling communications.

Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail

Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

Current source based standard-cell model for accurate timing analysis of combinational logic cells.

Mohamed Mahmoud, Amr Wassal, Alaa B. El-Rouby, Rafik Guindi

Proceedings of the 20th IEEE International Conference on Electronics, 2013

2012

An accurate power delivery system (PDS) design methodology for high-speed digital systems.

Shaymaa M. Nabil, Alaa B. El-Rouby, Ahmed H. Khalil

Int. J. Circuit Theory Appl., 2012

A closed form expression for TSV-based on-chip spiral inductor.

Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail

Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012

Modeling and analysis of through silicon via: Electromagnetic and device simulation approach.

Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail

Proceedings of the 19th IEEE International Conference on Electronics, Circuits and Systems, 2012

Effect of non-uniform substrate doping profile on the electrical performance of through-silicon-via for low power application.

Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea Ismail

Proceedings of the International Conference on Energy Aware Computing, 2012

2011

Compact lumped element model for TSV in 3D-ICs.

Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011

Body contact based TSV equalizer.

Khaled Mohamed, Alaa B. El-Rouby, Yehea I. Ismail, Hani F. Ragai

Proceedings of the 6th IEEE International Design and Test Workshop, 2011

Equivalent lumped element models for various n-port Through Silicon Vias networks.

Khaled Salah, Hani F. Ragai, Yehea I. Ismail, Alaa B. El-Rouby

Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011