André Martins Pio de Mattos

According to our database, André Martins Pio de Mattos authored at least 6 papers between 2021 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

FloripaSat-2: An Open-Source Platform for CubeSats.

Gabriel Mariano Marcelino, André Martins Pio de Mattos, João Cláudio Elsen Barcellos, Brenda Fernandes Ribeiro, Laio Oriel Seman, Edemar Morsch Filho, Eduardo Augusto Bezerra

IEEE Embed. Syst. Lett., March, 2024

2023

Payload-XL: A Platform for the In-Orbit Validation of the BRAVE FPGA.

Felipe Viel, Kleber R. Gouveia, Edilberto Costa, Márcio Oliveira, Miguel Boing, André Martins Pio de Mattos, Gabriel Mariano Marcelino, David Merodio Codinachs, Laio Oriel Seman, Eduardo Augusto Bezerra

IEEE Embed. Syst. Lett., June, 2023

Using HARV-SoC for Reliable Sensing Applications in Radiation Harsh Environments.

André Martins Pio de Mattos, Douglas A. dos Santos, Carolina Imianosky, Douglas R. Melo, Luigi Dilillo

Proceedings of the 9th International Workshop on Advances in Sensors and Interfaces, 2023

Characterization of a Fault-Tolerant RISC-V System-on-Chip for Space Environments.

Douglas A. dos Santos, André Martins Pio de Mattos, Douglas R. Melo, Luigi Dilillo

Proceedings of the IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, 2023

2022

Neutron Irradiation Testing and Analysis of a Fault-Tolerant RISC-V System-on-Chip.

Douglas A. dos Santos, André Martins Pio de Mattos, Lucas M. Luza, Carlo Cazzaniga, Maria Kastriotou, Douglas R. Melo, Luigi Dilillo

Proceedings of the IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, 2022

2021

Technology Impact on Neutron-Induced Effects in SDRAMs: A Comparative Study.

Lucas Matana Luza, Daniel Söderström, André Martins Pio de Mattos, Eduardo Augusto Bezerra, Carlo Cazzaniga, Maria Kastriotou, Christian Poivey, Luigi Dilillo

Proceedings of the 16th International Conference on Design & Technology of Integrated Systems in Nanoscale Era, 2021