Artur Wymyslowski

According to our database¹, Artur Wymyslowski authored at least 23 papers between 2007 and 2017.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

Timeline

Legend:

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In proceedings

Article

PhD thesis

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Links

On csauthors.net:

Bibliography

2017

Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2017

2016

Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2016

2015

Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2015

Adhesion work analysis through molecular modeling and wetting angle measurement.

[BibT_eX]

[DOI]

Dawid Jan Król

Artur Wymyslowski

Kamil Nouri Allaf

Microelectron. Reliab., 2015

2014

Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2014

Improving co-design of smart sensor front-ends.

[BibT_eX]

[DOI]

Ryszard Swierczynski

Krzysztof Urbanski

Artur Wymyslowski

Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

2013

Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials.

[BibT_eX]

[DOI]

Artur Wymyslowski

Lukasz Dowhan

Microelectron. Reliab., 2013

Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2013

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2013

2012

2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2012

A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging.

[BibT_eX]

[DOI]

Alexander W. J. Gielen

Microelectron. Reliab., 2012

2011

2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2011

Numerical prototyping methods in microsystem accelerometers design.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2011

Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2011

2010

Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2010

2009

Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2009

2008

Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.

[BibT_eX]

[DOI]

Artur Wymyslowski

Microelectron. Reliab., 2008

An approach of numerical multi-objective optimization in stacked packaging.

[BibT_eX]