Bart Vandevelde

According to our database1, Bart Vandevelde authored at least 24 papers between 2003 and 2017.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2017
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.
Microelectron. Reliab., 2017

Improved and accurate physics-of-failure (PoF) methodology for qualification and lifetime assessment of electronic systems.
Microelectron. Reliab., 2017

2016
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.
Microelectron. Reliab., 2016

2015
Impact of oxide liner properties on TSV Cu pumping and TSV stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.
Microelectron. Reliab., 2014

2012
MEMS packaging and reliability: An undividable couple.
Microelectron. Reliab., 2012

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.
Microelectron. Reliab., 2012

Modeling and Control of Electrowetting Induced Droplet Motion.
Micromachines, 2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
Cu pumping in TSVs: Effect of pre-CMP thermal budget.
Microelectron. Reliab., 2011

Design and implementation of flexible and stretchable systems.
Microelectron. Reliab., 2011

Fine grain thermal modeling and experimental validation of 3D-ICs.
Microelectron. J., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2008
Design of metal interconnects for stretchable electronic circuits.
Microelectron. Reliab., 2008

Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling.
Microelectron. J., 2008

2007
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectron. Reliab., 2007

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
Microelectron. Reliab., 2007

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly.
Microelectron. Reliab., 2007

2004
Package and solder joint reliability analysed by FEM simulation and experiments.
Microelectron. Reliab., 2004

Characterization and FE analysis on the shear test of electronic materials.
Microelectron. Reliab., 2004

2003
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages.
Microelectron. Reliab., 2003


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