Bastian Latsch

Orcid: 0000-0001-9929-5694

According to our database1, Bastian Latsch authored at least 14 papers between 2020 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2025
Vibrotactile Phantom Sensations in Haptic Wrist Rotation Guidance.
IEEE Trans. Haptics, 2025

Applying Palpation Forces on a Lower Jaw Model Using a Collaborative Robotic Arm.
Proceedings of the International Conference On Rehabilitation Robotics, 2025

2024
Modular Wireless Inertial Motion Capture System with Self-Calibration.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Force Myography Sensors for Gait Phase Detection.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Wearable Ballistocardiography for Unobtrusive Respiratory and Heart Rate Monitoring.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Force Sensor for Versatile Single-Step Sensor Integration in 3D-Printed Parts.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Integration of EMG Electrodes by Disruptive 3D Printing Into a Mandibular Brace.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Single-Step 3D Printing of Flexible Ferroelectret Sensors with Large Air Cavities.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Human-Exoskeleton Interaction Force Estimation Based on Quasi-Direct Drive Actuators.
Proceedings of the 10th IEEE RAS/EMBS International Conference for Biomedical Robotics and Biomechatronics, 2024

2023
Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

2022
Ultrasensitive and low-cost insole for gait analysis using piezoelectrets.
Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022

2020
Wearable Vibrotactile Interface Using Phantom Tactile Sensation for Human-Robot Interaction.
Proceedings of the Haptics: Science, Technology, Applications, 2020


  Loading...