Omar Ben Dali

According to our database, Omar Ben Dali authored at least 5 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films.

Youssef Sellami, Omar Ben Dali, Romol Chadda, Sergey Zhukov, Mahdi Guermazi, Alexander A. Altmann, Heinz von Seggern, Bastian Latsch, Niklas Schäfer, Mario Kupnik

Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.

Bastian Latsch, Omar Ben Dali, Romol Chadda, Niklas Schäfer, Alexander A. Altmann, Martin Grimmer, Philipp Beckerle, Mario Kupnik

Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.

Romol Chadda, Omar Ben Dali, Bastian Latsch, Esan Sundaralingam, Mario Kupnik

Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023

2022

Ultrasensitive and low-cost insole for gait analysis using piezoelectrets.

Omar Ben Dali, Youssef Sellami, Sergey Zhukov, Heinz von Seggern, Niklas Schäfer, Bastian Latsch, Gerhard M. Sessler, Philipp Beckerle, Mario Kupnik

Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022

2021

Biodegradable additive manufactured ferroelectret as mechanical sensor.

Omar Ben Dali, Sergey Zhukov, Claas Hartmann, Heinz von Seggern, Gerhard M. Sessler, Mario Kupnik

Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021