Lynne M. Gignac

According to our database, Lynne M. Gignac authored at least 5 papers between 2006 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

A Comprehensive Study on the Pillar Size of OTS-PCM Memory with an Optimized Process and Scaling Trends Down to Sub-10 nm for SCM Applications.

Wei-Chih Chien, E. K. Lai, L. Buzi, C. W. Cheng, C. W. Yeh, A. Ray, Lynne M. Gignac, N. Gong, H. Y. Cheng, A. Grun, D. Y. Lee, W. Kim, A. Majumdar, Douglas M. Bishop, Robert L. Bruce, D. Daudelin, H. Y. Ho, M. J. BrightSky, H. L. Lung

Proceedings of the IEEE International Memory Workshop, 2023

2022

Endurance Evaluation on OTS-PCM Device using Constant Current Stress Scheme.

Wei-Chih Chien, Lynne M. Gignac, Y. C. Chou, C. H. Yang, N. Gong, H. Y. Ho, C. W. Yeh, H. Y. Cheng, W. Kim, I. T. Kuo, E. K. Lai, C. W. Cheng, L. Buzi, A. Ray, C. S. Hsu, Robert L. Bruce, Matthew BrightSky, H. L. Lung

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Mushroom-Type phase change memory with projection liner: An array-level demonstration of conductance drift and noise mitigation.

Robert L. Bruce, Syed Ghazi Sarwat, Irem Boybat, Cheng-Wei Cheng, Wanki Kim, S. R. Nandakumar, Charles Mackin, Timothy Philip, Zuoguang Liu, Kevin Brew, Nanbo Gong, Injo Ok, Praneet Adusumilli, Katie Spoon, Stefano Ambrogio, Benedikt Kersting, Thomas Bohnstingl, Manuel Le Gallo, Andrew Simon, Ning Li, Iqbal Saraf, Jin-Ping Han, Lynne M. Gignac, John M. Papalia, Tenko Yamashita, Nicole Saulnier, Geoffrey W. Burr, Hsinyu Tsai, Abu Sebastian, Vijay Narayanan, Matthew BrightSky

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2018

Future on-chip interconnect metallization and electromigration.

Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2006

Electromigration of Cu/low dielectric constant interconnects.

Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg

Microelectron. Reliab., 2006