King-Ning Tu

According to our database, King-Ning Tu authored at least 8 papers between 2005 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology.

Yulong Chen, Xiewen Wen, King-Ning Tu, Yingxia Liu

Proceedings of the IEEE International Conference on Integrated Circuits, 2023

2017

Growth competition between layer-type and porous-type Cu₃Sn in microbumps.

David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu

Microelectron. Reliab., 2017

2013

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy.

King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen

Microelectron. Reliab., 2013

Reliability of micro-interconnects in 3D IC packages.

C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai

Microelectron. Reliab., 2013

2011

Reliability challenges in 3D IC packaging technology.

King-Ning Tu

Microelectron. Reliab., 2011

2009

Recent research advances in Pb-free solders.

Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu

Microelectron. Reliab., 2009

2006

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects.

M. Y. Yan, King-Ning Tu, A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy

Microelectron. Reliab., 2006

2005

Three-dimensional impedance engineering for mixed-signal system-on-chip applications.

Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005