C. Y. Khor

According to our database, C. Y. Khor authored at least 12 papers between 2010 and 2024.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2024

Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations.

W. M. Faizal, C. Y. Khor, Suhaimi Shahrin, M. H. M. Hazwan, M. Ahmad, M. N. Misbah, A. H. M. Haidiezul

Comput., January, 2024

2020

Computational fluid dynamics modelling of human upper airway: A review.

W. M. Faizal, Nik Nazri Nik Ghazali, C. Y. Khor, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Norliza Binti Ibrahim, Roziana M. Razi

Comput. Methods Programs Biomed., 2020

2019

A review of fluid-structure interaction simulation for patients with sleep related breathing disorders with obstructive sleep.

W. M. Faizal, Nik Nazri Nik Ghazali, Irfan Anjum Badruddin, M. Z. Zainon, Aznijar Ahmad Yazid, Mohamad Azlin Bin Ali, C. Y. Khor, Norliza Binti Ibrahim, Roziana M. Razi

Comput. Methods Programs Biomed., 2019

2015

Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.

M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid

Simul. Model. Pract. Theory, 2015

2014

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz

Microelectron. Reliab., 2014

Recent fluid-structure interaction modeling challenges in IC encapsulation - A review.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid

Microelectron. Reliab., 2014

2013

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2013

Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging.

C. Y. Khor, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2013

2012

Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology.

C. Y. Khor, Mohd Zulkifly Abdullah

Simul. Model. Pract. Theory, 2012

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2012

Investigation of the fluid/structure interaction phenomenon in IC packaging.

C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan

Microelectron. Reliab., 2012

2010

Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process.

C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2010