W. C. Leong

According to our database, W. C. Leong authored at least 4 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2014

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz

Microelectron. Reliab., 2014

2013

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2013

2012

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2012

Investigation of the fluid/structure interaction phenomenon in IC packaging.

C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan

Microelectron. Reliab., 2012