Chun-Sean Lau

According to our database, Chun-Sean Lau authored at least 3 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2014

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz

Microelectron. Reliab., 2014

Recent fluid-structure interaction modeling challenges in IC encapsulation - A review.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid

Microelectron. Reliab., 2014

2012

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method.

Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2012