Kripesh Vaidyanathan

According to our database1, Kripesh Vaidyanathan authored at least 5 papers between 2002 and 2010.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2010
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.
Microelectron. Reliab., 2010

2009
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.
Microelectron. Reliab., 2009

2008
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).
Microelectron. Reliab., 2008

2006
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging.
Microelectron. Reliab., 2006

2002
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.
Microelectron. Reliab., 2002


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