Dawei Wang
Orcid: 0000-0001-5612-6313Affiliations:
- Hangzhou Dianzi University, Hangzhou, China
According to our database1,
Dawei Wang authored at least 22 papers
between 2018 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integration.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2026
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., March, 2026
A Proposal of Fast Thermal Simulation Method for 2.5-D Advanced Packaging to Enable Efficient Thermal-Aware Placement Optimization.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2026
Parallel Simulation of Radiation-Electrothermal Synergistic Effect in LDMOSFET and FinFET Devices.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2026
2025
Equalizer Optimization Method Based on Local Multi-Constraint Modeling-Bayesian Optimization With Region Partitioning.
IEEE Trans. Circuits Syst. I Regul. Pap., October, 2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2025
Proper Orthogonal Decomposition and Long Short-Term Memory Neural Network-Based Multiphysics Digital Twin Model for Electronic Device Online Condition Monitoring.
IEEE Trans. Instrum. Meas., 2025
2024
IEEE Trans. Very Large Scale Integr. Syst., August, 2024
An Absorptive Common-Mode Suppression Filter Based on Resistor-Loaded M-Type Structure.
IEEE Trans. Circuits Syst. II Express Briefs, July, 2024
Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN.
Microelectron. J., 2024
2022
IEEE Trans. Ind. Electron., 2022
Symmetry, 2022
Sensors, 2022
Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.
Microelectron. J., 2022
2021
On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits.
IET Circuits Devices Syst., 2021
IEEE Access, 2021
2020
Fully coupled electrothermal simulation of resistive random access memory (RRAM) array.
Sci. China Inf. Sci., 2020
IEEE Access, 2020
2019
An Improved Algorithm for Drift Diffusion Transport and Its Application on Large Scale Parallel Simulation of Resistive Random Access Memory Arrays.
IEEE Access, 2019
IEEE Access, 2019
2018
IEEE Access, 2018