Easa AliAbbasi

According to our database, Easa AliAbbasi authored at least 9 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2025

Scene2Hap: Combining LLMs and Physical Modeling for Automatically Generating Vibrotactile Signals for Full VR Scenes.

Arata Jingu, Easa AliAbbasi, Paul Strohmeier, Jürgen Steimle

CoRR, April, 2025

Effect of Finger Orientation on Contact Stiffness and Area During Sliding.

Jahangier Ahmad, Easa AliAbbasi, MReza Alipour Sormoli, Cagatay Basdogan

IEEE Trans. Haptics, 2025

Sensorimotor Devices: Coupling Sensing and Actuation to Augment Bodily Experience.

Paul Strohmeier, Laia Turmo Vidal, Gabriela Vega, Courtney N. Reed, Alex Mazursky, Easa AliAbbasi, Ana Tajadura-Jiménez, Jürgen Steimle

Proceedings of the Extended Abstracts of the CHI Conference on Human Factors in Computing Systems, 2025

2024

Experimental Estimation of Gap Thickness and Electrostatic Forces Between Contacting Surfaces Under Electroadhesion.

Easa AliAbbasi, Ørjan Grøttem Martinsen, Fred-Johan Pettersen, James Edward Colgate, Cagatay Basdogan

Adv. Intell. Syst., April, 2024

Effect of Finger Moisture on Tactile Perception of Electroadhesion.

Easa AliAbbasi, Muhammad Muzammil, Omer Sirin, Philippe Lefèvre, Ørjan Grøttem Martinsen, Cagatay Basdogan

IEEE Trans. Haptics, 2024

Electro-Mechanical Contact Interactions Between Human Finger and Touchscreen Under Electroadhesion.

Easa AliAbbasi

CoRR, 2024

Tactile Perception of Electroadhesion: Effect of DC versus AC Stimulation and Finger Moisture.

Easa AliAbbasi, Muhammad Muzammil, Omer Sirin, Philippe Lefèvre, Ørjan Grøttem Martinsen, Cagatay Basdogan

CoRR, 2024

2023

Tactile Perception of Coated Smooth Surfaces.

Easa AliAbbasi, Volkan Aydingul, Alperen Sezgin, Utku Er, Seniz Turkuz, Cagatay Basdogan

IEEE Trans. Haptics, 2023

2022

Frequency-Dependent Behavior of Electrostatic Forces Between Human Finger and Touch Screen Under Electroadhesion.

Easa AliAbbasi, MReza Alipour Sormoli, Cagatay Basdogan

IEEE Trans. Haptics, 2022