Chee Lip Gan

Orcid: 0000-0002-8420-3168

Affiliations:
  • Nanyang Technological University, Temasek Laboratories, Singapore


According to our database1, Chee Lip Gan authored at least 28 papers between 2004 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
A Comprehensive Data Retrieval and Correction Approach From 40-nm Flash Memory With Selective Chemical Engraving.
IEEE Trans. Inf. Forensics Secur., 2024

Explainable automated data estimation in Logic State Imaging of embedded SRAM.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

A Security Assessment of Protected Execute-Only Firmware in Microcontrollers Through Selective Chemical Engraving.
Proceedings of the IEEE International Symposium on Hardware Oriented Security and Trust, 2024

2022
Selective Staining on Non-Volatile Memory Cells for Data Retrieval.
IEEE Trans. Inf. Forensics Secur., 2022

Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.
Proceedings of the Workshop on Fault Detection and Tolerance in Cryptography, 2022

2018
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.
Microelectron. Reliab., 2018

2017
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.
Microelectron. Reliab., 2017

Characterisation of defects generated during constant current InGaN-on-silicon LED operation.
Microelectron. Reliab., 2017

Extensive Laser Fault Injection Profiling of 65 nm FPGA.
J. Hardw. Syst. Secur., 2017

2016
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation.
Microelectron. Reliab., 2016

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.
Microelectron. Reliab., 2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.
Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.
Microelectron. Reliab., 2016

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.
Microelectron. Reliab., 2016

Comprehensive Laser Sensitivity Profiling and Data Register Bit-Flips for Cryptographic Fault Attacks in 65 Nm FPGA.
Proceedings of the Security, Privacy, and Applied Cryptography Engineering, 2016

2015
Unsupervised learning for signal mapping in dynamic photon emission.
Microelectron. Reliab., 2015

Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Copper micro and nano particles mixture for 3D interconnections application.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Customized glass sealant for ceramic substrates for high temperature electronic application.
Microelectron. Reliab., 2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.
Microelectron. Reliab., 2014

2013
Bidirectional electromigration failure.
Microelectron. Reliab., 2013

Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.
Microelectron. Reliab., 2013

2012
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress.
Microelectron. Reliab., 2012

2011
Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization.
Microelectron. Reliab., 2011

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2007
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.
Microelectron. J., 2007

2005
Electromigration Reliability Comparison of Cu and Al Interconnects.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005

2004
Circuit Level Reliability Analysis of Cu Interconnects.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004


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