Chee Lip Gan

According to our database, Chee Lip Gan authored at least 26 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

A Comprehensive Data Retrieval and Correction Approach From 40-nm Flash Memory With Selective Chemical Engraving.

Xiao Mei Zeng, Qing Liu, Chee Lip Gan

IEEE Trans. Inf. Forensics Secur., 2024

2022

Selective Staining on Non-Volatile Memory Cells for Data Retrieval.

Xiao Mei Zeng, Qing Liu, Jing Yun Tay, Chee Lip Gan

IEEE Trans. Inf. Forensics Secur., 2022

Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.

Samuel Chef, Chung Tah Chua, Jing Yun Tay, Jason Cheah, Chee Lip Gan

Proceedings of the Workshop on Fault Detection and Tolerance in Cryptography, 2022

2018

Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.

Wardhana A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2018

2017

Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.

Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2017

Characterisation of defects generated during constant current InGaN-on-silicon LED operation.

Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Y. Y. Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan

Microelectron. Reliab., 2017

Extensive Laser Fault Injection Profiling of 65 nm FPGA.

Jakub Breier, Wei He, Shivam Bhasin, Dirmanto Jap, Samuel Chef, Hock Guan Ong, Chee Lip Gan

J. Hardw. Syst. Secur., 2017

2016

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation.

Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2016

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.

Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen

Microelectron. Reliab., 2016

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition.

Adeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.

Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2016

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.

Chung Tah Chua, Hock Guan Ong, Kevin Sanchez, Philippe Perdu, Chee Lip Gan

Microelectron. Reliab., 2016

Comprehensive Laser Sensitivity Profiling and Data Register Bit-Flips for Cryptographic Fault Attacks in 65 Nm FPGA.

Wei He, Jakub Breier, Shivam Bhasin, Dirmanto Jap, Hock Guan Ong, Chee Lip Gan

Proceedings of the Security, Privacy, and Applied Cryptography Engineering, 2016

2015

Unsupervised learning for signal mapping in dynamic photon emission.

Samuel Chef, Sabir Jacquir, Kevin Sanchez, Philippe Perdu, Stéphane Binczak, Chee Lip Gan

Microelectron. Reliab., 2015

Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing.

Wardhana A. Sasangka, Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Copper micro and nano particles mixture for 3D interconnections application.

Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Customized glass sealant for ceramic substrates for high temperature electronic application.

Ahmed Sharif, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.

Adeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen

Microelectron. Reliab., 2014

2013

Bidirectional electromigration failure.

M. K. Lim, Vassilios A. Chouliaras, Chee Lip Gan, Vincent M. Dwyer

Microelectron. Reliab., 2013

Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.

F. L. Lau, Riko I. Made, Wahyuaji Narottama Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, Chee Lip Gan

Microelectron. Reliab., 2013

2012

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress.

Meng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan

Microelectron. Reliab., 2012

2011

Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization.

Fulvio Infante, Philippe Perdu, H. B. Kor, Chee Lip Gan, Dean Lewis

Microelectron. Reliab., 2011

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).

Fa Xing Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2007

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Microelectron. J., 2007

2005

Electromigration Reliability Comparison of Cu and Al Interconnects.

Syed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005

2004

Circuit Level Reliability Analysis of Cu Interconnects.

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004