Fumiaki Takashima

According to our database, Fumiaki Takashima authored at least 2 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

A Novel Omnidirectional 3D Test Access Architecture for Advanced System-on-Wafer (SoW) Applications.

Hiroyuki Iwata, Sandeep Kumar Goel, Ankita Patidar, Fumiaki Takashima, Frank Lee

Proceedings of the IEEE International Test Conference, 2025

2023

A Case Study on IEEE 1838 Compliant Multi-Die 3DIC DFT Implementation.

Anshuman Chandra, Moiz Khan, Ankita Patidar, Fumiaki Takashima, Sandeep Kumar Goel, Bharath Shankaranarayanan, Vuong Nguyen, Vistrita Tyagi, Manish Arora

Proceedings of the IEEE International Test Conference, 2023