Gabriel M. Rebeiz
Affiliations:- University of California, San Diego, USA
According to our database1,
Gabriel M. Rebeiz
authored at least 49 papers
between 1992 and 2023.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 1997, "For the development of novel microwave and millimeter-wave antennas, receivers and circuits using micromachining techniques.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
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on id.loc.gov
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Bibliography
2023
A Wideband Ultra-Low Noise 15-55 GHz Dual-Beam Receive Phased-Array Beamformer with 2.9-4.2 dB NF.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023
2022
An Eight-Element 140-GHz Wafer-Scale IF Beamforming Phased-Array Receiver With 64-QAM Operation in CMOS RFSOI.
IEEE J. Solid State Circuits, 2022
An Eight-Element 136-147 GHz Wafer-Scale Phased-Array Transmitter With 32 dBm Peak EIRP and >16 Gbps 16QAM and 64QAM Operation.
IEEE J. Solid State Circuits, 2022
High Efficiency D-Band Multiway Power Combined Amplifiers With 17.5-19-dBm Psat and 14.2-12.1% Peak PAE in 45-nm CMOS RFSOI.
IEEE J. Solid State Circuits, 2022
A Multi-Band 16-52-GHz Transmit Phased Array Employing 4 × 1 Beamforming IC With 14-15.4-dBm P<sub>sat</sub> for 5G NR FR2 Operation.
IEEE J. Solid State Circuits, 2022
2021
Octave-Tuning Dual-Core Folded VCO Leveraging a Triple-Mode Switch-Less Tertiary Magnetic Loop.
IEEE J. Solid State Circuits, 2021
A 10-130 GHz Distributed Power Amplifier Achieving 2.6 THz GBW with Peak 13.1 dBm Output P1dB for Ultra-Wideband Applications in 90nm SiGe HBT Technology.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2021
2020
A 22.3-nW, 4.55 cm<sup>2</sup> Temperature-Robust Wake-Up Receiver Achieving a Sensitivity of -69.5 dBm at 9 GHz.
IEEE J. Solid State Circuits, 2020
A 28-37 GHz Triple-Stage Transformer-Coupled SiGe LNA with 2.5 dB Minimum NF for Low Power Wideband Phased Array Receivers.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2020
2019
Design of Tunable Multi-Pole Multi-Zero Bandpass Filters and Diplexer With High Selectivity and Isolation.
IEEE Trans. Circuits Syst. I Regul. Pap., 2019
A DC-to-108-GHz CMOS SOI Distributed Power Amplifier and Modulator Driver Leveraging Multi-Drive Complementary Stacked Cells.
IEEE J. Solid State Circuits, 2019
IEEE J. Solid State Circuits, 2019
IEEE Access, 2019
A 0.1-to-0.2V Transformer-Based Switched-Mode Folded DCO in 22nm FDSOI With Active Step-Down Impedance Achieving 197dBc/Hz Peak FoM and 40MHz/V Frequency Pushing.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019
A Compact DC-to-108GHz Stacked-SOI Distributed PA/Driver Using Multi-Drive Inter-Stack Coupling, Achieving 1.525THz GBW, 20.8dBm Peak P1dB, and Over 100Gb/s in 64-QAM and PAM-4 Modulation.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019
A 5G 24-30 GHz 2x32 Element Dual-Polarized Dual-Beam Phased Array Base-Station for 2x2 MIMO System.
Proceedings of the 2019 IEEE Global Communications Conference, 2019
2018
IEEE J. Solid State Circuits, 2018
A<i>D</i>-Band Digital Transmitter with 64-QAM and OFDM Free-Space Constellation Formation.
IEEE J. Solid State Circuits, 2018
A Low-Cost Scalable 32-Element 28-GHz Phased Array Transceiver for 5G Communication Links Based on a 2×2 Beamformer Flip-Chip Unit Cell.
IEEE J. Solid State Circuits, 2018
Proceedings of the 2018 IEEE Custom Integrated Circuits Conference, 2018
Proceedings of the 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2018
Proceedings of the 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2018
2017
W-Band Direct-Modulation >20-Gb/s Transmit and Receive Building Blocks in 32-nm SOI CMOS.
IEEE J. Solid State Circuits, 2017
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017
Proceedings of the 2017 IEEE International Geoscience and Remote Sensing Symposium, 2017
A 400 MHz 4.5 nW -63.8 dBm sensitivity wake-up receiver employing an active pseudo-balun envelope detector.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
A 13.2-dBm, 138-GHz I/Q RF-DAC with 64-QAM and OFDM free-space constellation formation.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
2013
IEEE J. Solid State Circuits, 2013
A 108-114 GHz 4 × 4 Wafer-Scale Phased Array Transmitter With High-Efficiency On-Chip Antennas.
IEEE J. Solid State Circuits, 2013
A 2-Bit, 24 dBm, Millimeter-Wave SOI CMOS Power-DAC Cell for Watt-Level High-Efficiency, Fully Digital m-ary QAM Transmitters.
IEEE J. Solid State Circuits, 2013
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
2012
A Low-Power BiCMOS 4-Element Phased Array Receiver for 76-84 GHz Radars and Communication Systems.
IEEE J. Solid State Circuits, 2012
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012
2011
Double-balanced 130-180 GHz passive and balanced 145-165 GHz active mixers in 45 nm CMOS.
Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011
2010
2009
A Millimeter-Wave (40-45 GHz) 16-Element Phased-Array Transmitter in 0.18-µm SiGe BiCMOS Technology.
IEEE J. Solid State Circuits, 2009
2008
IEEE Trans. Circuits Syst. I Regul. Pap., 2008
IEEE J. Solid State Circuits, 2008
IEEE J. Solid State Circuits, 2008
IEEE J. Solid State Circuits, 2008
2007
IEEE J. Solid State Circuits, 2007
IEEE J. Solid State Circuits, 2007
A 30-40 GHz 1: 16 Internally Matched SiGe Active Power Divider for Phased Array Transmitters.
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007
2005
Proceedings of the 2005 International Conference on MEMS, 2005
2000
IEEE Trans. Aerosp. Electron. Syst., 2000
1998
1992