In Hak Baick

According to our database, In Hak Baick authored at least 2 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR).

Seongwon Jeong, Jinseok Kim, Ayoung Kim, Byungwook Kim, Moonsoo Lee, Jaewon Chang, In Hak Baick, Hanbyul Kang, Younggeun Ji, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

CPI reliability and EMI benefit for MIM CAP embedded C4 package.

Hyunsuk Chun, In Hak Baick, Sangsu Ha, Eunmi Kwon, Seungbae Lee, Seil Kim, Sangwoo Pae, Jongwoo Park

Proceedings of the IEEE International Reliability Physics Symposium, 2015