J. W. Tew

According to our database, J. W. Tew authored at least 1 paper in 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2008

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun

Microelectron. Reliab., 2008