F. L. Ng

According to our database, F. L. Ng authored at least 3 papers between 2003 and 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2008

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun

Microelectron. Reliab., 2008

2006

Inspection and Image Analysis of Nickel Sulphide Inclusions in Toughened Glass Panels.

X. Li, Z. P. Fang, F. L. Ng, L. P. Zhao, L. Zhao

Proceedings of the Ninth International Conference on Control, 2006

2003

Wafer Bonding Process Based On The Taguchi Analysis.

Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong

Int. J. Comput. Eng. Sci., 2003