Jacob R. Minz

According to our database, Jacob R. Minz authored at least 11 papers between 2004 and 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2008

Buffered clock tree synthesis for 3D ICs under thermal variations.

Jacob R. Minz, Xin Zhao, Sung Kyu Lim

Proceedings of the 13th Asia South Pacific Design Automation Conference, 2008

2007

Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction.

Eric Wong, Jacob R. Minz, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2007

2006

Multi-Objective Module Placement For 3-D System-On-Package.

Eric Wong, Jacob R. Minz, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2006

Block-level 3-D Global Routing With an Application to 3-D Packaging.

Jacob R. Minz, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006

Profile-guided microarchitectural floor planning for deep submicron processor design.

Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006

Optical routing for 3D system-on-package.

Jacob R. Minz, Somaskanda Thyagaraja, Sung Kyu Lim

Proceedings of the Conference on Design, Automation and Test in Europe, 2006

2005

Reliability-aware floorplanning for 3D circuits.

Jacob R. Minz, Eric Wong, Sung Kyu Lim

Proceedings of the Proceedings 2005 IEEE International SOC Conference, 2005

3D module placement for congestion and power noise reduction.

Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh

Proceedings of the 15th ACM Great Lakes Symposium on VLSI 2005, 2005

2004

Net and Pin Distribution for 3D Package Global Routing.

Jacob R. Minz, Mohit Pathak, Sung Kyu Lim

Proceedings of the 2004 Design, 2004

Profile-guided microarchitectural floorplanning for deep submicron processor design.

Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim

Proceedings of the 41th Design Automation Conference, 2004

Layer assignment for reliable system-on-package.

Jacob R. Minz, Sung Kyu Lim

Proceedings of the 2004 Conference on Asia South Pacific Design Automation: Electronic Design and Solution Fair 2004, 2004