John Sohn

According to our database, John Sohn authored at least 4 papers between 2022 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

The Role of a Wearable Electrodermal Activity Sensor in Assessing Individual Fall Risk.

John Sohn, Hoonyong Lee, Gaang Lee, Jesse V. Jacobs, Sanghyun Lee

J. Comput. Civ. Eng., 2026

2025

A Graph-Based approach for individual fall risk assessment through a wearable inertial measurement unit sensor.

Hoonyong Lee, John Sohn, Gaang Lee, Jesse V. Jacobs, Sanghyun Lee

Adv. Eng. Informatics, 2025

2024

A multimodal analysis of environmental stress experienced by older adults during outdoor walking trips: Implications for designing new intelligent technologies to enhance walkability in low-income Latino communities.

Raquel Yupanqui, John Sohn, Yoojun Kim, Raquel Flores, Hanwool Lee, Jinwoo Kim, SangHyun Lee, Youngjib Ham, Chanam Lee, Theodora Chaspari

Proceedings of the 26th International Conference on Multimodal Interaction, 2024

2022

A 1-Tb 4b/Cell 4-Plane 162-Layer 3D Flash Memory With a 2.4-Gb/s I/O Speed Interface.

Jong Yuh, Jason Li, Heguang Li, Yoshihiro Oyama, Cynthia Hsu, Pradeep Anantula, Stanley Jeong, Anirudh Amarnath, Siddhesh Darne, Sneha Bhatia, Tianyu Tang, Aditya Arya, Naman Rastogi, Naoki Ookuma, Hiroyuki Mizukoshi, Alex Yap, Demin Wang, Steve Kim, Yonggang Wu, Min Peng, Jason Lu, Tommy Ip, Seema Malhotra, David Han, Masatoshi Okumura, Jiwen Liu, John Sohn, Hardwell Chibvongodze, Muralikrishna Balaga, Aki Matsuda, Chakshu Puri, Chen Chen, Indra K. V, Chaitanya G, Venky Ramachandra, Yosuke Kato, Ravi Kumar, Huijuan Wang, Farookh Moogat, In-Soo Yoon, Kazushige Kanda, Takahiro Shimizu, Noboru Shibata, Takashi Shigeoka, Kosuke Yanagidaira, Takuyo Kodama, Ryo Fukuda, Yasuhiro Hirashima, Mitsuhiro Abe

Proceedings of the IEEE International Solid-State Circuits Conference, 2022