Stoyan Stoyanov

According to our database, Stoyan Stoyanov authored at least 19 papers between 2002 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module.

Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov

IEEE Access, 2024

2023

Modeling Insights Into the Assembly Challenges of Focal Plane Arrays.

Stoyan Stoyanov, Chris Bailey

IEEE Access, 2023

2020

Developing Computational Intelligence for Smart Qualification Testing of Electronic Products.

Mominul Ahsan, Stoyan Stoyanov, Chris Bailey, Alhussein Albarbar

IEEE Access, 2020

2019

Predictive analytics methodology for smart qualification testing of electronic components.

Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, Tracy Wotherspoon, Craig Hunt

J. Intell. Manuf., 2019

Data analytics to reduce stop-on-fail test in electronics manufacturing.

Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin

Open Comput. Sci., 2019

2018

Design, manufacture and test for reliable 3D printed electronics packaging.

Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey

Microelectron. Reliab., 2018

2016

Similarity approach for reducing qualification tests of electronic components.

Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis

Microelectron. Reliab., 2016

A robot leg with compliant tarsus and its neural control for efficient and adaptive locomotion on complex terrains.

Giuliano Di Canio, Stoyan Stoyanov, Jørgen Christian Larsen, John Hallam, Alexandr Kovalev, T. Kleinteich, Stanislav N. Gorb, Poramate Manoonpong

Artif. Life Robotics, 2016

Adaptive Combinatorial Neural Control for Robust Locomotion of a Biped Robot.

Giuliano Di Canio, Stoyan Stoyanov, Ignacio Torroba Balmori, Jørgen Christian Larsen, Poramate Manoonpong

Proceedings of the From Animals to Animats 14, 2016

2015

Statistical analysis of the impact of refinishing process on leaded components.

Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov

Microelectron. Reliab., 2015

Modelling the impact of refinishing processes on COTS components for use in aerospace applications.

Stoyan Stoyanov, Chris Bailey

Microelectron. Reliab., 2015

Periodic portfolio revision with transaction costs.

Krastyu Georgiev, Young Shin Kim, Stoyan Stoyanov

Math. Methods Oper. Res., 2015

2014

Social SDN: online social networks integration in wireless network provisioning.

Arjuna Sathiaseelan, Mohamed Said Seddiki, Stoyan Stoyanov, Dirk Trossen

Proceedings of the ACM SIGCOMM 2014 Conference, 2014

2013

Modelling methodology for thermal analysis of hot solder dip process.

Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott

Microelectron. Reliab., 2013

2012

Prognostics and Health Monitoring of High Power LED.

Thamo Sutharssan, Stoyan Stoyanov, Chris Bailey, Yasmine Z. Rosunally

Micromachines, 2012

2011

Fusion Approach for Prognostics Framework of Heritage Structure.

Yasmine Z. Rosunally, Stoyan Stoyanov, Chris Bailey, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell

IEEE Trans. Reliab., 2011

Integration of analytical techniques in stochastic optimization of microsystem reliability.

Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov

Microelectron. Reliab., 2011

2007

Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives.

Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez

Microelectron. Reliab., 2007

2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.

Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan

Microelectron. Reliab., 2002