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Y. C. Chan

This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.

Bibliography

2016
Temporal dynamics of visual working memory.
[BibTeX]
[DOI]
M. Sobczak-Edmans
,
T. H. B. Ng
,
Y. C. Chan
,
E. Chew
,
Kai-Hsiang Chuang
,
Shen-Hsing Annabel Chen
NeuroImage, 2016

2014
Reliability of washable wearable screen printed UHF RFID tags.
[BibTeX]
[DOI]
Johanna Virkki
,
Toni Björninen
,
T. Kellomäki
,
Sari Merilampi
,
I. Shafiq
,
Leena Ukkonen
,
Lauri Sydänheimo
,
Y. C. Chan
Microelectron. Reliab., 2014

Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO<sub>2</sub> composite solders.
[BibTeX]
[DOI]
Asit Kumar Gain
,
Y. C. Chan
Microelectron. Reliab., 2014

2012
FPGA Implementation of SRAM-based Ternary Content Addressable Memory.
[BibTeX]
[DOI]
Zahid Ullah
,
Manish Kumar Jaiswal
,
Y. C. Chan
,
Ray C. C. Cheung
Proceedings of the 26th IEEE International Parallel and Distributed Processing Symposium Workshops & PhD Forum, 2012

2011
Effect of additions of ZrO<sub>2</sub> nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads.
[BibTeX]
[DOI]
Asit Kumar Gain
,
Y. C. Chan
,
Winco K. C. Yung
Microelectron. Reliab., 2011

Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO<sub>2</sub> composite solder on flexible ball grid array substrates.
[BibTeX]
[DOI]
Asit Kumar Gain
,
Y. C. Chan
,
Winco K. C. Yung
Microelectron. Reliab., 2011

2010
Self-Monitoring and Self-Assessing Atomic Clocks.
[BibTeX]
[DOI]
Y. C. Chan
,
W. A. Johnson
,
S. K. Karuza
,
A. M. Young
,
J. C. Camparo
IEEE Trans. Instrum. Meas., 2010

Effect of nano Al<sub>2</sub>O<sub>3</sub> additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads.
[BibTeX]
[DOI]
Tama Fouzder
,
Asit Kumar Gain
,
Y. C. Chan
,
Ahmed Sharif
,
Winco K. C. Yung
Microelectron. Reliab., 2010

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy.
[BibTeX]
[DOI]
Mansur Ahmed
,
Tama Fouzder
,
Ahmed Sharif
,
Asit Kumar Gain
,
Y. C. Chan
Microelectron. Reliab., 2010

2009
Research advances in nano-composite solders.
[BibTeX]
[DOI]
Jun Shen
,
Y. C. Chan
Microelectron. Reliab., 2009

Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages.
[BibTeX]
[DOI]
Asit Kumar Gain
,
Y. C. Chan
,
Ahmed Sharif
,
N. B. Wong
,
Winco K. C. Yung
Microelectron. Reliab., 2009

2008
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow?
[BibTeX]
[DOI]
R. Smit
,
A. L. Brown
,
Y. C. Chan
Environ. Model. Softw., 2008

A hybrid prognostics methodology for electronic products.
[BibTeX]
[DOI]
Sachin Kumar
,
Myra Torres
,
Y. C. Chan
,
Michael G. Pecht
Proceedings of the International Joint Conference on Neural Networks, 2008

2006
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders.
[BibTeX]
[DOI]
Rashed Adnan Islam
,
Y. C. Chan
,
W. Jillek
,
Samia Islam
Microelectron. J., 2006

An Efficient Mechanism of TCP-Vegas on Mobile IP Networks.
[BibTeX]
[DOI]
C.-Y. Ho
,
Y.-C. Chan
,
Y.-C. Chen
Proceedings of the INFOCOM 2006. 25th IEEE International Conference on Computer Communications, 2006

2005
Study of anisotropic conductive adhesive joint behavior under 3-point bending.
[BibTeX]
[DOI]
M. J. Rizvi
,
Y. C. Chan
,
Chris Bailey
,
Hua Lu
Microelectron. Reliab., 2005

2004
Bias-HAST on tape ball grid array (TBGA) test pattern.
[BibTeX]
[DOI]
N. H. Yeung
,
Victor Lau
,
Y. C. Chan
Microelectron. Reliab., 2004

Thermal stability performance of anisotropic conductive film at different bonding temperatures.
[BibTeX]
[DOI]
S. C. Tan
,
Y. C. Chan
,
Y. W. Chiu
,
C. W. Tan
Microelectron. Reliab., 2004

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.
[BibTeX]
[DOI]
C. W. Tan
,
Y. C. Chan
,
H. P. Chan
,
N. W. Leung
,
C. K. So
Microelectron. Reliab., 2004

Effect of microwave preheating on the bonding performance of flip chip on flex joint.
[BibTeX]
[DOI]
Rashed Adnan Islam
,
Y. C. Chan
Microelectron. Reliab., 2004

2003
Behaviour of anisotropic conductive joints under mechanical loading.
[BibTeX]
[DOI]
C. W. Tan
,
Y. C. Chan
,
N. H. Yeung
Microelectron. Reliab., 2003

Effect of autoclave test on anisotropic conductive joints.
[BibTeX]
[DOI]
C. W. Tan
,
Y. C. Chan
,
N. H. Yeung
Microelectron. Reliab., 2003

2002
Application of adhesive bonding techniques in hard disk drive head assembly.
[BibTeX]
[DOI]
C. F. Luk
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2002

Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.
[BibTeX]
[DOI]
C. F. Luk
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.
[BibTeX]
[DOI]
Hua Lu
,
K. C. Hung
,
Stoyan Stoyanov
,
Chris Bailey
,
Y. C. Chan
Microelectron. Reliab., 2002

Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications.
[BibTeX]
[DOI]
S. H. Fan
,
Y. C. Chan
Microelectron. Reliab., 2002

Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects.
[BibTeX]
[DOI]
Y. W. Chiu
,
Y. C. Chan
,
S. M. Lui
Microelectron. Reliab., 2002

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
[BibTeX]
[DOI]
Y. C. Chan
,
D. Y. Luk
Microelectron. Reliab., 2002

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
[BibTeX]
[DOI]
Y. C. Chan
,
D. Y. Luk
Microelectron. Reliab., 2002

2001
Study of micro-BGA solder joint reliability.
[BibTeX]
[DOI]
P. L. Tu
,
Y. C. Chan
,
K. C. Hung
,
J. K. L. Lai
Microelectron. Reliab., 2001

Reliability of microBGA assembly using no-flow underfill.
[BibTeX]
[DOI]
P. L. Tu
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2001

Study of the self-alignment of no-flow underfill for micro-BGA assembly.
[BibTeX]
[DOI]
Y. C. Chan
,
P. L. Tu
,
K. C. Hung
Microelectron. Reliab., 2001

1985
FORTLOG = Fortran + Logique.
[BibTeX]
Y. C. Chan
Proceedings of the SPLT'85, 1985


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