K. C. Su

According to our database, K. C. Su authored at least 4 papers between 2002 and 2020.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2020

Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects.

Clement Huang, Alex Juan, K. C. Su

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2007

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration.

M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang

Microelectron. Reliab., 2007

2005

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment.

M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang

Microelectron. Reliab., 2005

2002

Locality Performance of Some Mesh-indexings.

H. K. Dai, K. C. Su

Proceedings of the International Conference on Parallel and Distributed Processing Techniques and Applications, 2002