Y. L. Lin

According to our database, Y. L. Lin authored at least 4 papers between 2005 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

TSV by 355 UV laser for 4G component packaging with micro-electroforming.

Cheng-Tang Pan, Y. C. Chen, Shao-Yu Wang, Y. T. Cheng, Chung-Kun Yen, Y. L. Lin, W. C. Shih

Microelectron. Reliab., 2017

2014

Electrospun PVDF fibers on bio-wings using multi-spinnerets.

Chung-Kun Yen, C. H. Tsao, Cheng-Tang Pan, H. C. Wu, Y. C. Lai, Zong-Hsin Liu, Y. L. Lin, Liwei Lin, S. W. Kuo, Y. S. Lu, H. L. Hung, S. W. Mao, C. F. Liu, Sheng-Chih Shen

Proceedings of the 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2014

2007

A 45nm dual-port SRAM with write and read capability enhancement at low voltage.

D. P. Wang, Hung-Jen Liao, Hiroyuki Yamauchi, Y. H. Chen, Y. L. Lin, S. H. Lin, D. C. Liu, Huan-Cheng Chang, W. Hwang

Proceedings of the 2007 IEEE International SOC Conference, 2007

2005

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment.

M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang

Microelectron. Reliab., 2005