Kele Shen

According to our database1, Kele Shen authored at least 18 papers between 2012 and 2019.

Collaborative distances:



In proceedings 
PhD thesis 




Traffic-Based Side-Channel Attack in Video Streaming.
IEEE/ACM Trans. Netw., 2019

NASR: NonAuditory Speech Recognition with Motion Sensors in Head-Mounted Displays.
Proceedings of the Wireless Algorithms, Systems, and Applications, 2018

Walls Have Ears: Traffic-based Side-channel Attack in Video Streaming.
Proceedings of the 2018 IEEE Conference on Computer Communications, 2018

A New Unicast-Based Multicast Scheme for Network-on-Chip Router and Interconnect Testing.
ACM Trans. Design Autom. Electr. Syst., 2016

Conditional forwarding: simple flow control to increase adaptivity for fully adaptive routing algorithms.
The Journal of Supercomputing, 2016

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2016

An Optimization Mechanism for Mid-Bond Testing of TSV-Based 3D SoCs.
IEICE Transactions, 2016

Complex Networks Clustering for Lower Power Scan Segmentation in At-Speed Testing.
IEICE Transactions, 2016

A novel two-phase heuristic for application mapping onto mesh-based Network-on-Chip.
IEICE Electronic Express, 2016

An innovative routing scheme to reduce communication delay in DMesh networks.
IEICE Electronic Express, 2015

A scan segmentation architecture for power controllability and reduction.
Proceedings of the 28th IEEE International System-on-Chip Conference, 2015

A General Methodology to Design Deadlock-Free Routing Algorithms for Mesh Networks.
Proceedings of the Algorithms and Architectures for Parallel Processing, 2015

A Novel Scan Segmentation Design for Power Controllability and Reduction in At-Speed Test.
Proceedings of the 24th IEEE Asian Test Symposium, 2015

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs.
JETC, 2014

Reconfigured test architecture optimization for TSV-based three-dimensional SoCs.
IEICE Electronic Express, 2014

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2014

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing.
Proceedings of the 23rd IEEE Asian Test Symposium, 2014

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs.
Proceedings of the 21st IEEE Asian Test Symposium, 2012