Cher Ming Tan

According to our database1, Cher Ming Tan authored at least 51 papers between 1999 and 2018.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

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Bibliography

2018
Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions.
IEEE Access, 2018

A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency.
Proceedings of the 27th Wireless and Optical Communication Conference, 2018

2016
Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation.
Microelectron. Reliab., 2016

A review on the humidity reliability of high power white light LEDs.
Microelectron. Reliab., 2016

Copper induced synthesis of graphene using amorphous carbon.
Microelectron. Reliab., 2016

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.
Microelectron. Reliab., 2016

Editorial.
Microelectron. Reliab., 2016

2014
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter.
Microelectron. Reliab., 2014

Methodology of reliability enhancement for high power LED driver.
Microelectron. Reliab., 2014

Modeling and analysis of gate-all-around silicon nanowire FET.
Microelectron. Reliab., 2014

Special section reliability and variability of devices for circuits and systems.
Microelectron. Reliab., 2014

2013
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling.
Reliab. Eng. Syst. Saf., 2013

The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Applications of finite element methods for reliability study of ULSI interconnections.
Microelectron. Reliab., 2012

Reliability study of LED driver - A case study of black box testing.
Microelectron. Reliab., 2012

Effect of IC layout on the reliability of CMOS amplifiers.
Microelectron. Reliab., 2012

Electromigration reliability of interconnections in RF low noise amplifier circuit.
Microelectron. Reliab., 2012

Degradation behavior of high power light emitting diode under high frequency switching.
Microelectron. Reliab., 2012

Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test.
Microelectron. Reliab., 2012

ICMAT 2011 - Reliability and variability of semiconductor devices and ICs.
Microelectron. Reliab., 2012

2010
Electromigration performance of Through Silicon Via (TSV) - A modeling approach.
Microelectron. Reliab., 2010

Addressing the challenges in solder resistance measurement for electromigration test.
Microelectron. Reliab., 2010

Humidity study of a-Si PV cell.
Microelectron. Reliab., 2010

Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model.
Microelectron. Reliab., 2010

Circuit level interconnect reliability study using 3D circuit model.
Microelectron. Reliab., 2010

Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects.
Microelectron. Reliab., 2010

Electromigration in ULSI Interconnections
International Series on Advances in Solid State Electronics and Technology, World Scientific, ISBN: 978-981-4467-93-3, 2010

2009
Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems".
Reliab. Eng. Syst. Saf., 2009

Analysis of humidity effects on the degradation of high-power white LEDs.
Microelectron. Reliab., 2009

Electromigration in width transition copper interconnect.
Microelectron. Reliab., 2009

Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI).
Microelectron. Reliab., 2009

2008
A framework to practical predictive maintenance modeling for multi-state systems.
Reliab. Eng. Syst. Saf., 2008

Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier.
J. Electronic Testing, 2008

2007
Finite element modeling of capacitive coupling voltage contrast.
Microelectron. Reliab., 2007

An approach to statistical analysis of gate oxide breakdown mechanisms.
Microelectron. Reliab., 2007

Room temperature observation of point defect on gold surface using thermovoltage mapping.
Microelectron. Reliab., 2007

Enhanced finite element modelling of Cu electromigration using ANSYS and matlab.
Microelectron. Reliab., 2007

2006
Development of highly accelerated electromigration test.
Microelectron. Reliab., 2006

Feasibility study of the application of voltage contrast to printed circuit board.
Microelectron. Reliab., 2006

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
Microelectron. Reliab., 2006

Device level electrical-thermal-stress coupled-field modeling.
Microelectron. Reliab., 2006

2005
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
Microelectron. Reliab., 2005

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
Microelectron. Reliab., 2005

Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications.
Microelectron. Reliab., 2005

Reliability screening through electrical testing for press-fit alternator power diode in automotive application.
Microelectron. Reliab., 2005

Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
Microelectron. Reliab., 2005

2004
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.
Microelectron. Reliab., 2004

2003
Influence Of Applied Load On Wafer Bonding In Vacuum.
International Journal of Computational Engineering Science, 2003

Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.
International Journal of Computational Engineering Science, 2003

2001
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
J. Electronic Testing, 2001

1999
Using power diode models for circuit simulations-a comprehensive review.
IEEE Trans. Industrial Electronics, 1999


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