Cher Ming Tan

According to our database, Cher Ming Tan authored at least 54 papers between 1999 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Concurrent Multiband CMOS Low Noise Amplifier Design for Internet of Things Applications.

Peerapat Phetpadriew, Bharatha Kumar Thangarasu, Nagarajan Mahalingam, Zhenghao Lu, Cher Ming Tan, Kiat Seng Yeo

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022

Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment.

Vimal Kant Pandey, Cher Ming Tan

Int. J. Circuit Theory Appl., 2022

2020

Electromagnetic Induced Failure in GaN-HEMT High-Frequency Power Amplifier.

Vivek Sangwan, Cher Ming Tan, Dipesh Kapoor, Hsien-Chin Chiu

IEEE Trans. Ind. Electron., 2020

2018

Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions.

Preetpal Singh, Cher Ming Tan

IEEE Access, 2018

A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency.

Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy

Proceedings of the 27th Wireless and Optical Communication Conference, 2018

2016

Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation.

Preetpal Singh, Cher Ming Tan, Liann-Be Chang

Microelectron. Reliab., 2016

A review on the humidity reliability of high power white light LEDs.

Preetpal Singh, Cher Ming Tan

Microelectron. Reliab., 2016

Copper induced synthesis of graphene using amorphous carbon.

Udit Narula, Cher Ming Tan, Chao-Sung Lai

Microelectron. Reliab., 2016

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation.

Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan

Microelectron. Reliab., 2016

Editorial.

Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou

Microelectron. Reliab., 2016

2014

Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter.

Cher Ming Tan, Wen Zhi Yu

Microelectron. Reliab., 2014

Methodology of reliability enhancement for high power LED driver.

Song Lan, Cher Ming Tan, Kevin Wu

Microelectron. Reliab., 2014

Modeling and analysis of gate-all-around silicon nanowire FET.

Xiangchen Chen, Cher Ming Tan

Microelectron. Reliab., 2014

Special section reliability and variability of devices for circuits and systems.

Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou

Microelectron. Reliab., 2014

2013

Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling.

Minh Duc Le, Cher Ming Tan

Reliab. Eng. Syst. Saf., 2013

The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material.

Jiye Zhang, Lin Zhang, Yuanwei Dong, Hongyu Li, Cher Ming Tan, Guangrui Xia, Chuan Seng Tan

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Applications of finite element methods for reliability study of ULSI interconnections.

Cher Ming Tan, Wei Li, Zhenghao Gan

Microelectron. Reliab., 2012

Reliability study of LED driver - A case study of black box testing.

Song Lan, Cher Ming Tan, Kevin Wu

Microelectron. Reliab., 2012

Effect of IC layout on the reliability of CMOS amplifiers.

Feifei He, Cher Ming Tan

Microelectron. Reliab., 2012

Electromigration reliability of interconnections in RF low noise amplifier circuit.

Feifei He, Cher Ming Tan

Microelectron. Reliab., 2012

Degradation behavior of high power light emitting diode under high frequency switching.

Sihan Chen, Cher Ming Tan, Guan Hong Tan, Feifei He

Microelectron. Reliab., 2012

Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test.

Sihan Joseph Chen, Cher Ming Tan, Boon Khai Eric Chen, Zhi Yong Shaun Chua

Microelectron. Reliab., 2012

ICMAT 2011 - Reliability and variability of semiconductor devices and ICs.

Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou

Microelectron. Reliab., 2012

2010

Electromigration performance of Through Silicon Via (TSV) - A modeling approach.

Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu

Microelectron. Reliab., 2010

Addressing the challenges in solder resistance measurement for electromigration test.

Yung Chuen Tan, Cher Ming Tan, T. C. Ng

Microelectron. Reliab., 2010

Humidity study of a-Si PV cell.

Cher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh

Microelectron. Reliab., 2010

Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model.

Feifei He, Cher Ming Tan

Microelectron. Reliab., 2010

Circuit level interconnect reliability study using 3D circuit model.

Feifei He, Cher Ming Tan

Microelectron. Reliab., 2010

Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects.

C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao

Microelectron. Reliab., 2010

Electromigration in ULSI Interconnections

Cher Ming Tan

International Series on Advances in Solid State Electronics and Technology, World Scientific, ISBN: 978-981-4467-93-3, 2010

2009

Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems".

Cher Ming Tan, Nagarajan Raghavan

Reliab. Eng. Syst. Saf., 2009

Analysis of humidity effects on the degradation of high-power white LEDs.

Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu

Microelectron. Reliab., 2009

Electromigration in width transition copper interconnect.

Arijit Roy, Yuejin Hou, Cher Ming Tan

Microelectron. Reliab., 2009

Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI).

Jie Liao, Cher Ming Tan, Geert Spierings

Microelectron. Reliab., 2009

2008

A framework to practical predictive maintenance modeling for multi-state systems.

Cher Ming Tan, Nagarajan Raghavan

Reliab. Eng. Syst. Saf., 2008

Reverse Breakdown Voltage Measurement for Power P⁺NN⁺ Rectifier.

Guangyu Huang, Cher Ming Tan

J. Electron. Test., 2008

2007

Finite element modeling of capacitive coupling voltage contrast.

Cher Ming Tan, Stanny Yanuar, Tai Chong Chai

Microelectron. Reliab., 2007

An approach to statistical analysis of gate oxide breakdown mechanisms.

Cher Ming Tan, Nagarajan Raghavan

Microelectron. Reliab., 2007

Room temperature observation of point defect on gold surface using thermovoltage mapping.

Arijit Roy, Cher Ming Tan, Sean J. O'Shea, Kedar Hippalgaonkar, Wulf Hofbauer

Microelectron. Reliab., 2007

Enhanced finite element modelling of Cu electromigration using ANSYS and matlab.

Wei Li, Cher Ming Tan

Microelectron. Reliab., 2007

2006

Development of highly accelerated electromigration test.

Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low

Microelectron. Reliab., 2006

Feasibility study of the application of voltage contrast to printed circuit board.

Cher Ming Tan, Zhenghao Gan, Tai Chong Chai

Microelectron. Reliab., 2006

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.

Arijit Roy, Cher Ming Tan

Microelectron. Reliab., 2006

Device level electrical-thermal-stress coupled-field modeling.

Guangyu Huang, Cher Ming Tan

Microelectron. Reliab., 2006

2005

Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.

Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low

Microelectron. Reliab., 2005

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.

Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim

Microelectron. Reliab., 2005

Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications.

Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu

Microelectron. Reliab., 2005

Reliability screening through electrical testing for press-fit alternator power diode in automotive application.

Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang

Microelectron. Reliab., 2005

Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.

Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen

Microelectron. Reliab., 2005

2004

Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology.

Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang

Microelectron. Reliab., 2004

2003

Influence Of Applied Load On Wafer Bonding In Vacuum.

W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai

Int. J. Comput. Eng. Sci., 2003

Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.

S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie

Int. J. Comput. Eng. Sci., 2003

2001

A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).

Cher Ming Tan, Kelvin Ngan Chong Yeo

J. Electron. Test., 2001

1999

Using power diode models for circuit simulations-a comprehensive review.

Cher Ming Tan, King-Jet Tseng

IEEE Trans. Ind. Electron., 1999