Ki-Don Lee

According to our database, Ki-Don Lee authored at least 7 papers between 2002 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Polarity Dependency of MOL-TDDB in FinFET.

Manisha Sharma, Hokyung Park, Yinghong Zhao, Ki-Don Lee, Liangshan Chen, Joonah Yoon, Rakesh Ranjan, Caleb Dongkyan Kwon, Hyewon Shim, Myungsoo Yeo, Shin-Young Chung, Jon Haefner

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of Barrier Metal Thickness on SRAM Reliability.

Rakesh Ranjan, Pavitra Ramadevi Perepa, Ki-Don Lee, Hokyung Park, Peter Kim, Ganesh Chakravarthy Yerubandi, Jon Haefner, Caleb Dongkyun Kwon, Minjung Jin, Wenhao Zhou, Hyewon Shim, Shin-Young Chung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Polarity Dependence and Metal Density Impact on Multi-Layer Inter-Level TDDB for High Voltage Application.

Yinghong Zhao, Ki-Don Lee, Manisha Sharma, Joonah Yoon, Rakesh Ranjan, Md Iqbal Mahmud, Caleb Dongkyan Kwon, Myungsoo Yeo

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Reverse Body Bias Dependence of HCI Reliability in Advanced FinFET.

Md Iqbal Mahmud, Rakesh Ranjan, Ki-Don Lee, Pavitra Ramadevi Perepa, Caleb Dongkyun Kwon, Seungjin Choo, Kihyun Choi

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Systematic Study of Process Impact on FinFET Reliability.

Rakesh Ranjan, Ki-Don Lee, Md Iqbal Mahmud, Mohammad Shahriar Rahman, Pavitra Ramadevi Perepa, Charles Briscoe LaRow, Caleb Dongkyun Kwon, Maihan Nguyen, Minhyo Kang, Ashish Kumar Jha, Ahmed Shariq, Shamas Musthafa Ummer, Susannah Laure Prater, Hyunchul Sagong, HwaSung Rhee

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Trap Density Modulation for IO FinFET NBTI Improvement.

Rakesh Ranjan, Charles B. LaRow, Ki-Don Lee, Minhyo Kang, Pavitra R. Perepa, Md. Shahriar Rahman, Bong Ki Lee, David Moreau, Carolyn Cariss-Daniels, Timothy Basford, Colby Callahan, Maihan Nguyen, Gil Heyun Choi, Hyunchul Sagong, HwaSung Rhee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2002

Electromigration reliability issues in dual-damascene Cu interconnections.

Ennis T. Ogawa, Ki-Don Lee, Volker A. Blaschke, Paul S. Ho

IEEE Trans. Reliab., 2002