Shin-Young Chung

According to our database, Shin-Young Chung authored at least 9 papers between 2019 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM.

Taiki Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Polarity Dependency of MOL-TDDB in FinFET.

Manisha Sharma, Hokyung Park, Yinghong Zhao, Ki-Don Lee, Liangshan Chen, Joonah Yoon, Rakesh Ranjan, Caleb Dongkyan Kwon, Hyewon Shim, Myungsoo Yeo, Shin-Young Chung, Jon Haefner

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk.

SungMan Rhee, Hyunjin Kim, Sangku Park, Taiki Uemura, Yuchul Hwang, Seungjin Choo, Jinju Kim, Hwasung Rhee, Shin-Young Chung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of Barrier Metal Thickness on SRAM Reliability.

Rakesh Ranjan, Pavitra Ramadevi Perepa, Ki-Don Lee, Hokyung Park, Peter Kim, Ganesh Chakravarthy Yerubandi, Jon Haefner, Caleb Dongkyun Kwon, Minjung Jin, Wenhao Zhou, Hyewon Shim, Shin-Young Chung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs.

Seongkyung Kim, Hyerim Park, Eunyu Choi, Young Han Kim, Dahyub Kim, Hyewon Shim, Shin-Young Chung, Paul Jung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices.

Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology.

Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.

Seongkyung Kim, Ukjin Jung, Seungjin Choo, Kihyun Choi, Tae-Jin Chung, Shin-Young Chung, Euncheol Lee, Juhun Park, Deokhan Bae, Myungyoon Um

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2019

Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method.

Ghil-Geun Oh, Jong-Ho Eun, Shin-Young Chung, Brandon Lee

Proceedings of the 2019 International SoC Design Conference, 2019