Kikuo Muramatsu

According to our database, Kikuo Muramatsu authored at least 2 papers between 2022 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging.

Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata

IEICE Trans. Electron., October, 2023

2022

Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging.

Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Takuji Miki, Makoto Nagata, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo

Proceedings of the IEEE International Reliability Physics Symposium, 2022