Rikuu Hasegawa

According to our database1, Rikuu Hasegawa authored at least 4 papers between 2022 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
On-Chip Evaluation of Voltage Drops and Fault Occurrence Induced by Si Backside EM Injection.
Proceedings of the Constructive Side-Channel Analysis and Secure Design, 2024

2023
Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging.
IEICE Trans. Electron., October, 2023

Characterization of Backside ESD Impacts on Integrated Circuits.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging.
Proceedings of the IEEE International Reliability Physics Symposium, 2022


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