Kou Maekawa

According to our database, Kou Maekawa authored at least 1 paper in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.

Weng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O'Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang, David Marx, David Grant, Russ Dudley

Proceedings of the IEEE International Conference on 3D System Integration, 2009