Russ Dudley

According to our database, Russ Dudley authored at least 2 papers in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.

Weng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O'Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang, David Marx, David Grant, Russ Dudley

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Wafer Thickness Sensor (WTS) for etch depth measurement of TSV.

David Marx, David Grant, Russ Dudley, Andy Rudack, W. H. Teh

Proceedings of the IEEE International Conference on 3D System Integration, 2009