Meng Lian
Orcid: 0000-0002-3036-058XAffiliations:
- Technical University of Munich, Chair of Electronic Design Automation, Germany
According to our database1,
Meng Lian authored at least 9 papers
between 2021 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
ACM Trans. Design Autom. Electr. Syst., May, 2026
ParaVOM: Parallel-Execution-Aware Validation and Optimization for Multilayered Continuous-Flow Microfluidic Biochips.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2026
2025
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2025
Proceedings of the 26th International Symposium on Quality Electronic Design, 2025
SRing: A Sub-Ring Construction Method for Application-Specific Wavelength-Routed Optical NoCs.
Proceedings of the Design, Automation & Test in Europe Conference, 2025
Dynamic Topology-Aware Flow Path Construction and Scheduling Optimization for Multilayered Continuous-Flow Microfluidic Biochips.
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025
2023
FXT-Route: Efficient High-Performance PCB Routing with Crosstalk Reduction Using Spiral Delay Lines.
Proceedings of the 2023 International Symposium on Physical Design, 2023
ARMM: Adaptive Reliability Quantification Model of Microfluidic Designs and its Graph-Transformer-Based Implementation.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
2021
Manufacturing Cycle-Time Optimization Using Gaussian Drying Model for Inkjet-Printed Electronics.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021