Siyuan Liang

Orcid: 0000-0001-6819-8293

Affiliations:
  • Chinese University of Hong Kong, Hong Kong, SAR, China


According to our database1, Siyuan Liang authored at least 9 papers between 2022 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
Multilayer Package Power/Ground Planes Synthesis With Balanced DC IR Drops: A Game-Theoretic Optimization Approach.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2026

2025
Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer: Design, Synthesis, and Adaptation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2025

MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

AutoRE: Bayesian-Optimization-based Automatic Reliability Enhancement Tool for Flow-based Microfluidic Biochips.
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025

2024
RABER: Reliability-Aware Bayesian-Optimization-based Control Layer Escape Routing for Flow-based Microfluidics.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

LaMUX: Optimized Logic-Gate-Enabled High-Performance Microfluidic Multiplexer Design.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

Late Breaking Results: Efficient Built-in Self-Test for Microfluidic Large-Scale Integration (mLSI).
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

2023
ARMM: Adaptive Reliability Quantification Model of Microfluidic Designs and its Graph-Transformer-Based Implementation.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

2022
CoMUX: Combinatorial-Coding-Based High-Performance Microfluidic Control Multiplexer Design.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022


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