Min Miao

According to our database, Min Miao authored at least 18 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing.

Shiliang Zhu, Min Miao

IEEE Geosci. Remote. Sens. Lett., 2024

2023

A PAM4 transceiver design scheme with threshold adaptive and tap adaptive.

Xuena Liu, Zhensong Li, Hao Wen, Min Miao, Yuduo Wang, Zhuwei Wang

EURASIP J. Adv. Signal Process., December, 2023

A physics-based modeling method of THz Schottky diode for circuit simulation.

Weiheng Zhao, Yudi Zhao, Min Miao

Microelectron. J., 2023

2022

A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging.

Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu

Microelectron. J., 2022

TSV Defects Classification with Machine Learning Approaches.

Haitao He, Changhao Luo, Junchen Dong, Yudi Zhao, Min Miao, Kai Zhao

Proceedings of the 2022 IEEE International Conference on Integrated Circuits, 2022

2021

Design of EMI and suppression structure based on bar-via.

Na Li, Min Miao

Microelectron. J., 2021

Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer.

Zhuanzhuan Zhang, Min Miao, Xiaolong Duan

Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021

2020

Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System.

Zhensong Li, Min Miao, Zhuwei Wang

IEEE Access, 2020

2018

Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images.

Haoyang Li, Hong Zheng, Chuanzhao Han, Haibo Wang, Min Miao

Remote. Sens., 2018

On Continuous Speech Recognition of Indian English.

Xin Jin, Keliang Zhang, Xian Huang, Min Miao

Proceedings of the 2018 International Conference on Algorithms, 2018

2017

An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias.

Xiaole Cui, Xiaoxin Cui, Yewen Ni, Min Miao, Yufeng Jin

IEEE Trans. Very Large Scale Integr. Syst., 2017

2013

Electrical characterization of integrated passive devices using thin film technology for 3D integration.

Xin Sun, Yunhui Zhu, Zhen Hua Liu, Qing-hu Cui, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin

J. Zhejiang Univ. Sci. C, 2013

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.

Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.

Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

2012

A 3D micro-channel cooling system embedded in LTCC packaging substrate.

Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin

Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012

2011

A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate.

Hua Gan, Yufeng Jin, Min Miao, Xin Sun

Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

2010

A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.

Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan

Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010

2009

Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.

Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo

Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009