Yufeng Jin

According to our database1, Yufeng Jin authored at least 35 papers between 2003 and 2018.

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Bibliography

2018
Parylene-MEMS technique-based flexible electronics.
SCIENCE CHINA Information Sciences, 2018

2017
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias.
IEEE Trans. VLSI Syst., 2017

A novel calibration method of electronic compass based on multi-redundancy.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

A method for high accuracy heading angle combined with ellipsoid calibration and BP neural network.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

Vibration effects rectification of IMU attitude based on gradient descent algorithm.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

Research of on-line modeling and real-time filtering for MEMS gyroscope random noise.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

High accuracy extend Kalman filter for posture measurement based on attitude and heading reference system.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

A newly fast method of magnetometer calibration based on hexahedron measurement.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

A new calibration method for MEMS accelerometers with genetic algorithm.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

Optimization and simulation of satellite IMS access gateway and signal's propagation dela.
Proceedings of the 2017 IEEE International Conference on Real-time Computing and Robotics, 2017

Anemometer for detection of very low speed air flow with three-dimensional directionality.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017

Research on the Zero-Rate Output compensation for MEMS vibratory gyroscopes.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017

2015
A TSV repair method for clustered faults.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

An enhanced decoder for multiple-bit error correcting BCH codes.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

Post-bond test for TSVs using voltage division.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

2013
Electrical characterization of integrated passive devices using thin film technology for 3D integration.
Journal of Zhejiang University - Science C, 2013

Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Research on the structure of ultrathin Si PIN detector.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

A Fuzzy Enhancement Method for Transmission Line Image Based on Genetic Algorithm.
Proceedings of the Ninth International Conference on Intelligent Information Hiding and Multimedia Signal Processing, 2013

New DfT architectures for 3D-SICs with a wireless test port.
Proceedings of the IEEE 10th International Conference on ASIC, 2013

A new fast adopted image matching approach with arbitrary rotation.
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2013

2012
A 3D micro-channel cooling system embedded in LTCC packaging substrate.
Proceedings of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2012

2011
Development of TSV simulator: FASTsv.
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate.
Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

2010
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.
Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010

Fabrication and characterization of ultra-thin PIN detector.
Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010

2009
Signal modulation schemes comparison in the telemetry unit for retinal prosthesis system.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

Extraocular image processing for retinal prosthesis based on DSP.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

Multi-category human motion recognition based on MEMS inertial sensing data.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.
Proceedings of the 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2009

2008
Towards HMM based human motion recognition using MEMS inertial sensors.
Proceedings of the IEEE International Conference on Robotics and Biomimetics, 2008

PCA/ICA-based SVM for fall recognition using MEMS motion sensing data.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2008

2003
A Novel Wafer-Level Packaging Solution For Mems.
International Journal of Computational Engineering Science, 2003

Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding.
International Journal of Computational Engineering Science, 2003


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