Hua Gan

According to our database, Hua Gan authored at least 4 papers between 2005 and 2011.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2011

A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate.

Hua Gan, Yufeng Jin, Min Miao, Xin Sun

Proceedings of the 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2011

2010

A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge.

Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan

Proceedings of the 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2010

2006

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte

IEEE J. Solid State Circuits, 2006

2005

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005