Ming-C. Cheng
Orcid: 0000-0001-8092-5457
According to our database1,
Ming-C. Cheng
authored at least 13 papers
between 1998 and 2023.
Collaborative distances:
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Bibliography
2023
PODTherm-GP: A Physics-Based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUs.
IEEE Trans. Computers, October, 2023
Fast-Accurate Full-Chip Dynamic Thermal Simulation With Fine Resolution Enabled by a Learning Method.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023
2022
A methodology for thermal simulation of interconnects enabled by model reduction with material property variation.
J. Comput. Sci., 2022
2016
Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
2012
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012
2011
Inclusion of Chemical-Mechanical Polishing Variation in Statistical Static Timing Analysis.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2011
2009
Proceedings of the Annual Meeting of the IEEE Industry Applications Society, 2009
2004
Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs.
Microelectron. Reliab., 2004
Math. Comput. Simul., 2004
2003
Proceedings of the Computational Science and Its Applications, 2003
2001
An Upstream Flux Splitting Method for Hydrodynamic Modeling of Deep Submicron Devices.
VLSI Design, 2001
A Generalized Finite Element Method for Hydrodynamic Modeling of Short-channel Devices.
VLSI Design, 2001
1998
A New Concept for Solving the Boltzmann Transport Equation in Ultra-fast Transient Situations.
VLSI Design, 1998