Peck Cheng Lim

According to our database, Peck Cheng Lim authored at least 3 papers in 2003.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2003

Wafer Bonding Process Based On The Taguchi Analysis.

Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong

Int. J. Comput. Eng. Sci., 2003

A Novel Wafer-Level Packaging Solution For Mems.

Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong

Int. J. Comput. Eng. Sci., 2003

Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding.

Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang

Int. J. Comput. Eng. Sci., 2003