Jun Wei

Affiliations:

Singapore Institute of Manufacturing Technology, Singapore

According to our database¹, Jun Wei authored at least 5 papers in 2003.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of three.

Timeline

Legend:

Book In proceedings Article PhD thesis Dataset Other

Links

On csauthors.net:

Bibliography

2003

Influence Of Applied Load On Wafer Bonding In Vacuum.

[BibT_eX]

[DOI]

Int. J. Comput. Eng. Sci., 2003

Wafer Bonding Process Based On The Taguchi Analysis.

[BibT_eX]

[DOI]

Int. J. Comput. Eng. Sci., 2003

A Novel Wafer-Level Packaging Solution For Mems.

[BibT_eX]

[DOI]

Int. J. Comput. Eng. Sci., 2003

Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding.

[BibT_eX]

[DOI]

Int. J. Comput. Eng. Sci., 2003

Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.

[BibT_eX]

[DOI]

Int. J. Comput. Eng. Sci., 2003

Jun Wei

Timeline

Legend:

Links

On csauthors.net:

Bibliography

Loading...