Peter Schneider

Orcid: 0000-0003-2509-021X

Affiliations:
  • Fraunhofer-Institut für Integrierte Schaltungen (IIS-EAS), Dresden, Germany


According to our database1, Peter Schneider authored at least 11 papers between 2008 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2018
A High Speed Asynchronous Multi Input Pipeline for Compaction and Transfer of Parallel SIMD Data.
Proceedings of the 24th IEEE International Symposium on Asynchronous Circuits and Systems, 2018

2017
Implementation of an asynchronous bundled-data router for a GALS NoC in the context of a VSoC.
Proceedings of the 20th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2017

2016
Simulation platform for application development on a vision-system-on-chip with integrated signal processing.
J. Electronic Imaging, 2016

Software Environment for Holistic Vision-System-on-Chip Programming.
Proceedings of the Image Sensors and Imaging Systems 2016, 2016

2015
Current and future 3D activities at Fraunhofer.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Design rule check and layout versus schematic for 3D integration and advanced packaging.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2012
System level simulation - A core method for efficient design of MEMS and mechatronic systems.
Proceedings of the International Multi-Conference on Systems, Signals & Devices, 2012

2010
Challenges of simulating robust wireless sensor network applications in building automation environments.
Proceedings of 15th IEEE International Conference on Emerging Technologies and Factory Automation, 2010

Integration of multi physics modeling of 3D stacks into modern 3D data structures.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

Developing digital test sequences for through-silicon vias within 3D structures.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2008
Design support for Wireless Sensor Networks based on the IEEE 802.15.4 standard.
Proceedings of the IEEE 19th International Symposium on Personal, 2008


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