Phil Mawby

Orcid: 0000-0002-7800-5536

According to our database1, Phil Mawby authored at least 14 papers between 2007 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2022
In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors.
IEEE Trans. Instrum. Meas., 2022

2021
Bipolar Degradation monitoring of 4H-SiC MOSFET Power Devices by Electroluminescence Measurements.
Proceedings of the IECON 2021, 2021

2020
Non-Intrusive Methodologies for Characterization of Bias Temperature Instability in SiC Power MOSFETs.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2017
Evaluation of SiC Schottky Diodes Using Pressure Contacts.
IEEE Trans. Ind. Electron., 2017

2016
Temperature and Switching Rate Dependence of Crosstalk in Si-IGBT and SiC Power Modules.
IEEE Trans. Ind. Electron., 2016

Robustness and Balancing of Parallel-Connected Power Devices: SiC Versus CoolMOS.
IEEE Trans. Ind. Electron., 2016

Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules.
Microelectron. Reliab., 2016

2015
Accurate Analytical Modeling for Switching Energy of PiN Diodes Reverse Recovery.
IEEE Trans. Ind. Electron., 2015

The Impact of Temperature and Switching Rate on the Dynamic Characteristics of Silicon Carbide Schottky Barrier Diodes and MOSFETs.
IEEE Trans. Ind. Electron., 2015

2013
The impact of silicon carbide technology on grid-connected Distributed Energy resources.
Proceedings of the 4th IEEE PES Innovative Smart Grid Technologies Europe, 2013

2011
Conduction and switching loss comparison between an IGBT/Si-PiN diode pair and an IGBT/SiC-Schottky diode pair.
Proceedings of the 2nd IEEE PES International Conference and Exhibition on "Innovative Smart Grid Technologies", 2011

Super-junction trench MOSFETs for improved energy conversion efficiency.
Proceedings of the 2nd IEEE PES International Conference and Exhibition on "Innovative Smart Grid Technologies", 2011

2008
Fast Thermal Models for Power Device Packaging.
Proceedings of the Industry Applications Society Annual Meeting, 2008

2007
High doped MBE Si p-n and n-n heterojunction diodes on 4H-SiC.
Microelectron. J., 2007


  Loading...