Ping Li

Orcid: 0000-0003-1622-3607

Affiliations:
  • Power Device Business Group, China Resources Microelectronics (Chongqing) Limited, Chongqing, China
  • Chongqing University, School of Microelectronics and Communication Engineering, Chongqing, China
  • University of Electronic Science and Technology of China, Chengdu, China (PhD 2019)


According to our database1, Ping Li authored at least 9 papers between 2020 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2023
An Edge Neuromorphic Hardware With Fast On-Chip Error-Triggered Learning on Compressive Sensed Spikes.
IEEE Trans. Circuits Syst. II Express Briefs, July, 2023

2022
A Low-Cost FPGA Implementation of Spiking Extreme Learning Machine With On-Chip Reward-Modulated STDP Learning.
IEEE Trans. Circuits Syst. II Express Briefs, 2022

TEDOP: A Tiny Event-Driven Neural Network Hardware Core Enabling On-Chip Spike-Driven Synaptic Plasticity.
Proceedings of the 2022 IEEE International Conference on Integrated Circuits, 2022

2021
A Low-Cost High-Speed Object Tracking VLSI System Based on Unified Textural and Dynamic Compressive Features.
IEEE Trans. Circuits Syst. II Express Briefs, 2021

CompSNN: A lightweight spiking neural network based on spatiotemporally compressive spike features.
Neurocomputing, 2021

A Pixel-Parallel Array Processor without Computational Logic for Computational Image Sensors.
Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021

Exploiting Memristors for Neuromorphic Reinforcement Learning.
Proceedings of the 3rd IEEE International Conference on Artificial Intelligence Circuits and Systems, 2021

2020
A High-Speed Low-Cost VLSI System Capable of On-Chip Online Learning for Dynamic Vision Sensor Data Classification.
Sensors, 2020

A High-speed Low-cost CNN Inference Accelerator for Depthwise Separable Convolution.
Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020


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