Roy Meade

According to our database, Roy Meade authored at least 9 papers between 2015 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Monolithic Microring-based WDM Optical I/O for Heterogeneous Computing.

Mark Wade, Daniel Jeong, Byungchae Kim, Mason Zhang, Woorham Bae, Chong Zhang, Pavan Bhargava, Derek Van Orden, Shahab Ardalan, Chandarasekaran Ramamurthy, Erik Anderson, Austin Katzin, Haiwei Lu, Sidney Buchbinder, Behrooz Beheshtian, Anatoly Khilo, Michael Rust, Chen Li, Forrest Sedgwick, John Michael Fini, Roy Meade, Vladimir Stojanovic, Chen Sun

Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser.

Mark T. Wade, Erik Anderson, Shahab Ardalan, Woorham Bae, Behrooz Beheshtian, Sidney Buchbinder, Ken Chang, Paulo Chao, Haritha Eachempatti, John Frey, Eric Jan, Austin Katzin, Anatoly Khilo, Derek Kita, Uma Krishnamoorthy, Chen Li, Haiwei Lu, Fernando Luna, Christopher Madden, Lynne Okada, Mukundrai Patel, Chandru Ramamurthy, Manan Raval, Radek Roucka, Kit Robberson, Michael Rust, Derek Van Orden, Ron Zeng, Mason Zhang, Vladimir Stojanovic, Forrest Sedgwick, Roy Meade, Norman Chan, John Michael Fini, Byungchae Kim, Songtao Liu, Chong Zhang, Daniel Jeong, Pavan Bhargava, Matthew Sysak, Chen Sun

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO.

Kaveh Hosseini, Edwin Kok, Sergey Y. Shumarayev, Chia-Pin Chiu, Arnab Sarkar, Asako Toda, Yanjing Ke, Allen Chan, Daniel Jeong, Mason Zhang, Sangeeta Raman, Thungoc Tran, Kumar Abhishek Singh, Pavan Bhargava, Chong Zhang, Haiwei Lu, Ravi Mahajan, Xiaoqian Li, Nitin Deshpande, Conor O'Keeffe, Tim Tri Hoang, Uma Krishnamoorthy, Chen Sun, Roy Meade, Vladimir Stojanovic, Mark Wade

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

2020

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O.

Mark T. Wade, Roy Meade, Chandru Ramamurthy, Michael Rust, Forrest Sedgwick, Vladimir Stojanovic, Derek Van Orden, Chong Zhang, Chen Sun, Sergey Y. Shumarayev, Conor O'Keeffe, Erik Anderson, Tim T. Hoang, David Kehlet, Ravi V. Mahajan, Matthew T. Guzy, Allen Chan, Tina Tran, Shahab Ardalan, Pavan Bhargava, Sidney Buchbinder, Michael L. Davenport, John Michael Fini, Haiwei Lu, Chen Li

IEEE Micro, 2020

2019

TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module.

Roy Meade, Shahab Ardalan, Michael L. Davenport, John Michael Fini, Chen Sun, Mark T. Wade, Alexandra Wright-Gladstein, Chong Zhang

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2018

Innovative practices on silicon photonics.

Roy Meade, Woosung Kim, Richard Otte, Eugene R. Atwood

Proceedings of the 36th IEEE VLSI Test Symposium, 2018

A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O.

Mark T. Wade, Michael L. Davenport, Marc De Cea Falco, Pavan Bhargava, John Michael Fini, Derek Van Orden, Roy Meade, Evelina Yeung, Rajeev R. Ram, Milos A. Popovic, Vladimir Stojanovic, Chen Sun

Proceedings of the European Conference on Optical Communication, 2018

2017

WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation Disaggregated Cloud Data Centers.

Mohammad Shahanshah Akhter, Paul Somogyi, Chen Sun, Mark T. Wade, Roy Meade, Pavan Bhargava, Sen Lin, Nandish Mehta

Proceedings of the 25th IEEE Annual Symposium on High-Performance Interconnects, 2017

2015

A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS.

Chen Sun, Michael Georgas, Jason Orcutt, Benjamin Moss, Yu-Hsin Chen, Jeffrey Shainline, Mark T. Wade, Karan Mehta, Kareem Nammari, Erman Timurdogan, Daniel L. Miller, Ofer Tehar-Zahav, Zvi Sternberg, Jonathan C. Leu, Johanna Chong, Reha Bafrali, Gurtej Sandhu, Michael Watts, Roy Meade, Milos A. Popovic, Rajeev J. Ram, Vladimir Stojanovic

IEEE J. Solid State Circuits, 2015