S. K. W. Seah

According to our database, S. K. W. Seah authored at least 4 papers between 2008 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Constitutive modeling of solder alloys for drop-impact applications.

Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah

Microelectron. Reliab., 2016

2009

Advances in the drop-impact reliability of solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai

Microelectron. Reliab., 2009

2008

A review of board level solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim

Microelectron. Reliab., 2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008