J. F. J. M. Caers

According to our database, J. F. J. M. Caers authored at least 3 papers between 2005 and 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

Advances in the drop-impact reliability of solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai

Microelectron. Reliab., 2009

2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008

2005

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.

Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

Microelectron. Reliab., 2005