Sebastian Brand
Orcid: 0000-0003-2278-2042Affiliations:
- Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
According to our database1,
Sebastian Brand
authored at least 8 papers
between 2010 and 2021.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
-
on orcid.org
On csauthors.net:
Bibliography
2021
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR).
Proceedings of the 17th IEEE International Conference on Automation Science and Engineering, 2021
2020
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020
2017
Microelectron. Reliab., 2017
2016
Microelectron. Reliab., 2016
Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.
Microelectron. Reliab., 2016
Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy.
Microelectron. Reliab., 2016
2015
Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices.
Microelectron. Reliab., 2015
2010
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy.
Microelectron. Reliab., 2010