Sebastian Brand

Orcid: 0000-0003-2278-2042

Affiliations:
  • Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany


According to our database1, Sebastian Brand authored at least 8 papers between 2010 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

Online presence:

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Bibliography

2021
Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR).
Proceedings of the 17th IEEE International Conference on Automation Science and Engineering, 2021

2020
Enhanced non-contact ultrasonic testing using an air-coupled optical microphone.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020

2017
Study of GHz-SAM sensitivity to delamination in BEOL layers.
Microelectron. Reliab., 2017

2016
Magnetic field and current density imaging using off-line lock-in analysis.
Microelectron. Reliab., 2016

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.
Microelectron. Reliab., 2016

Detection and analysis of stress-induced voiding in Al-power lines by acoustic GHz-microscopy.
Microelectron. Reliab., 2016

2015
Scanning acoustic GHz-microscopy versus conventional SAM for advanced assessment of ball bond and metal interfaces in microelectronic devices.
Microelectron. Reliab., 2015

2010
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy.
Microelectron. Reliab., 2010


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