Luka Kljucar

According to our database, Luka Kljucar authored at least 4 papers between 2016 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

Study of GHz-SAM sensitivity to delamination in BEOL layers.

Ahmad Khaled, Luka Kljucar, Sebastian Brand, Michael Kögel, Robert Aertgeerts, Ruben Nicasy, Ingrid De Wolf

Microelectron. Reliab., 2017

2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016